TechInsights has released preliminary findings from its teardown analysis of NVIDIA’s Blackwell HGX B200 platform, highlighting significant developments in cloud AI and high-performance computing. The report identifies SK hynix as the supplier of the high-bandwidth memory (HBM3E) used in the platform’s GB100 GPU, which features an advanced packaging design by TSMC. This new architecture, which includes TSMC’s CoWoS-L packaging, promises substantial performance improvements and represents…